Silicon wafer cutting fluid
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  • Silicon wafer cutting fluid

Silicon wafer cutting fluid

Product Features:

★ Excellent cooling and lubricity: effectively dissipates heat, forms a protective film on the silicon surface, reduces cutting resistance, and extends the service life of the diamond wire.
★ Excellent dispersion performance: ensures rapid dispersion of silicon particles generated during the cutting process;
★ Excellent cleaning performance, reducing silicon powder deposition on the diamond wire, preventing silicon powder agglomeration, and enhancing wafer cleanliness;
★ Eco-friendly: non-irritating to the skin and environmentally friendly.
It is suitable for the processing of various brittle materials, including silicon wafers, solar-grade crystalline silicon, semiconductors, chips, and wafers, effectively increasing cutting throughput.

Service Hotline: +86-513-88442062

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Product Details

Silicon wafer cutting fluid is a water-based lubricant-coolant that delivers excellent lubrication and cooling performance. It rapidly wets the silicon wafer cutting interface, efficiently removes silicon powder particles, enhances cutting efficiency, eliminates cutting debris, and reduces damage to the silicon wafers during the cutting process.

Typical Data

Project

Quality indicators

Appearance

Colorless to pale yellow liquid

Density (20°C), g/cm 3

1.023 ± 0.02

pH value

5-7

 

Precautions

How to use

1. Dilute with deionized water at a weight ratio of 1:100 to 1:300;
2. Avoid mixing with other chemicals.

Precautions

1. Store the cutting fluid in a cool, well-ventilated, and dry location, away from direct sunlight and high temperatures.
2. Any unused cutting fluid must have its container lid tightly sealed to prevent the ingress of moisture and impurities.

Packaging, Storage, and Transportation

20 L/drum, 200 L/drum, 1000 L/drum
Packaging, storage, and transportation shall comply with non-hazardous goods requirements.

Shelf life: one year

Keywords:

Silicon wafer cutting fluid

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